EIAJ ED 4701 PDF

JEITA EIAJ Standards (as of August in ). General System, Category and Title , Spec. No. (Test No.) Life Test, JEITA EIAJ ED/ Life TestⅠ, Steady. Japan Electronics and Information Technology Industries Association (JEITA) Standards EIAJ ED/ Environmental and endurance test methods for. EIAJ ED/ Test Method Ta=85°C, 85%RH, Vcc=80V, Vdd=6V. hrs. 0/ AC. EIAJ ED B Ta=°C,%RH.

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Kouji Obinata Sony Corp. JEITA standards are established independently to any existing patents on the products, materials or processes they cover.

Climatic test methods C: The treatment which the specimens are submitted to before carrying out the initial measurements and tests. The standards related to integrated circuits IC and separate volume Appendix had been published, and the standards related to discrete devices SD separate volume Appendix and separate volume Appendix had been published. The temperature of the air at a place separated by a distance sufficient to neglect the influence of the heat radiation from the specimen, when it is cooled by natural convection.

The heating treatment, equivalent to the actual mounting by soldering, which the specimens are submitted to. This website uses cookies. Shizuo Kunita Sanken Electric Co. Because SiC does not have a long history as a semiconductor material, and because it does not have much of a track record compared with Si power devices, there may not be much awareness of the level of its reliability.

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There is a tendency for people to be hesitating over things that are new and untested. The temperature on the surface of 7401 specimen at the point specified in the relevant specifications. Back to the main subject. The junction temperature of the specimen. Reliability of SiC-SBDs Because SiC does not have a long history as a semiconductor material, and because it does not have much of a track record compared with Si power devices, there may not be much awareness of ieaj level of its reliability.

Reliability Evaluation Fee : FUJITSU QUALITY LABORATORY LIMITED

The directions of the specimen are defined as shown in Figures 1 to 8. Moreover, during the electrical measurements, the measurement conditions eiam not exceed the maximum ratings. Osamu Nakayama Kawasaki Microelectronics, Inc. The semiconductor devices provided for the tests.

The temperature of the air surrounding the specimen.

When evaluating semiconductor devices, in addition to the electrical and mechanical specifications and wiaj, reliability is another important factor. The final revision planing was decided to above-mentioned 6 separate volumes. In particular, utmost attention should be paid to the precautions indicated in the detail specifications.

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Portable appliance testing eiahlookup Electromagnetic compatibility wikipedialookup Semiconductor device wikipedialookup. The temperature at the reference point specified in the relevant specifications. Anyone who has studied the reliability of semiconductor devices and has actually performed evaluations will probably be familiar with these standards and conditions.

However, the reader can consider the data that we shall present below. The 4 Appendixes confused the newest specification searching.

SiC Power Device

Main revision points are as follow. Thank you for your participation! Takahiro Ito Rohm Co. Hiroyoshi Odaira Seiko Epson Corp. Kohki Ohara Ricoh Co. Miscellaneous test methods 2 Endurance tests Test by devices D: Below are listed the members of deliberation of this standard.

Reliability Evaluation Fee

But in SiC-SBDs, the occurrence of such failure is regarded as unlikely because the recovery current is extremely small. Junichi Mitsuhashi Mitsubishi Electric Corp. The visual inspection and the electrical and eaj measurements which the specimens are submitted to in the first place before carrying out the tests.

When the specimen has outward appearance different from those ones shown in the figures, its directions are defined in the relevant specifications.